Muhannad Bakir

At Georgia Tech he leads pioneering work in heterogeneous integration, advanced packaging, and interconnect technologies for high-performance computing and AI systems. His research focuses on 3D integration, glass substrates, and thermal management solutions for next-generation semiconductor architectures. Muhannad holds a Ph.D. in Electrical Engineering from Georgia Tech and has authored over 250 publications and patents. He collaborates extensively with industry and government to accelerate innovation in chiplet-based systems and advanced packaging ecosystems.