Sung Jin Kim
Sung Jin Kim
With over 30 years in semiconductor and microelectronic packaging, he leads innovation in glass substrate technologies for AI, HPC, and defense applications. Dr. Kim previously held executive roles at SKC, Georgia Tech, Foxconn, Daeduck Electronics, UTAC, and Amkor. He holds a Ph.D. in Electrical Engineering from the Technical University of Dresden and is credited with over 200 U.S. patents, including pioneering work in embedded packaging and microSD card design.
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