{"id":31716,"date":"2026-02-17T09:55:59","date_gmt":"2026-02-17T08:55:59","guid":{"rendered":"https:\/\/www.fundacionbankinter.org\/?post_type=noticias&p=31716"},"modified":"2026-09-08T17:44:54","modified_gmt":"2026-09-08T15:44:54","slug":"tungsten-future-of-semiconductors-alternative-to-silicon","status":"publish","type":"noticias","link":"https:\/\/www.fundacionbankinter.org\/en\/news\/tungsten-future-of-semiconductors-alternative-to-silicon\/","title":{"rendered":"Tungsten and the Future of Semiconductors: The High-Power Alternative to Silicon?"},"content":{"rendered":"\n

Silicon<\/strong><\/a> [a1]<\/a> has been the mainstay of microelectronics for more than half a century. However, the industry is beginning to look further. Extreme miniaturization, thermal limits, and increased energy demand are driving the exploration of new materials. In this scenario, tungsten<\/strong>, also known as tungsten<\/strong><\/a> (with the chemical symbol W), emerges: the metal with the highest melting point in the world (3,422 \u00baC)<\/strong> and a key, although not very visible, component of today’s chips. <\/p>\n\n

Tungsten is already part of the microchips we use every day. Their presence is discreet, but essential. <\/p>\n\n

The limitations of silicon: why the industry is looking for new materials<\/strong><\/h2>\n\n

For decades, silicon has been the go-to material on which the entire semiconductor industry<\/a> has been built. Its abundance, cost and electronic properties have allowed an unprecedented technological scale. However, the current context places demands that go beyond what this material can efficiently offer. <\/p>\n\n

One of the main challenges is thermal management<\/strong>. As devices operate at higher power levels \u2013 especially in power electronics and industrial systems \u2013 the heat generated becomes a limiting factor. Over-temperature reduces efficiency, accelerates component aging, and compromises long-term reliability. <\/p>\n\n

Added to this is the extreme scaling of technology nodes<\/strong>. The continuous reduction in the size of transistors, which is key to improving performance and reducing consumption, introduces physical phenomena that are difficult to control, such as electrical leakage or degradation of interconnects. These effects are no longer marginal and force us to rethink both the design of the chips and the materials used. <\/p>\n\n

Finally, the electrification of the economy<\/strong> \u2013 with the growth of electric vehicles, renewable energies, data centres and smart grids \u2013 requires devices capable of operating stably for long periods, under demanding conditions and with high levels of electrical load. In these environments, durability and resistance to thermal and electrical stress take on strategic weight. <\/p>\n\n

As a result, sectors such as electric automotive, energy or telecommunications are driving a transition towards new materials and architectures<\/strong> that allow operating at higher temperatures, managing more power and guaranteeing sustained reliability. Silicon is still fundamental, but the industry is already actively working on its evolution and complementarity with other advanced materials. <\/p>\n\n

The role of tungsten in the new chip architecture<\/strong><\/h2>\n\n

This is one of the least visible \u2013 and most decisive \u2013 aspects of the current evolution of semiconductors.<\/p>\n\n

Tungsten plays a complementary role to the silicon inside the chip<\/strong>, especially in the internal architecture that allows millions of transistors to be reliably connected. Their contribution is concentrated in the so-called tungsten vias<\/strong>, a key structural element in advanced manufacturing processes.<\/em> <\/p>\n\n

Tungsten vias serve several critical functions:<\/p>\n\n